Solder flow-impeding plug on a lead frame

ABSTRACT

Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as first partial etch forming a trench. A non-conductive material that is adhesive to the lead frame is applied in the trench, such that the non-conductive material extends across the trench to form the solder flow-impeding plug. One or more components are attached to the internal surface of the lead frame and encapsulated. An external surface of the lead frame is etched at the dividing lines to disconnect different sections of lead frame as a second partial etch.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to U.S. ProvisionalApplication No. 61/710,753, filed on Oct. 7, 2012, which is incorporatedherein by reference.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view of an embodiment of a packaged circuitincluding a lead frame with a solder flow-impeding plug.

FIG. 1B is an enlarged cross-sectional view of one example of the solderflow-impeding plug and adjacent lead frame of FIG. 1A.

FIG. 2 is a cross-sectional view of an embodiment of the solderflow-impeding plug of FIGS. 1A and 1B.

FIG. 3 is an enlarged cross-sectional view of an alternative embodimentof a solder flow-impeding plug and adjacent lead frame.

FIG. 4 is an enlarged cross-sectional view of yet another embodiment ofa solder flow-impeding plug and adjacent lead frame.

FIG. 5 is a top cross-sectional view of the lead frame of FIG. 1.

FIGS. 6A-6I are cross-sectional views of example stages in a method ofmanufacturing a packaged circuit including a solder flow-impeding plug.

FIG. 7A is an enlarged cross-sectional view of another example of thestage shown in FIG. 6D of a solder flow-impeding plug in a lead frame.

FIG. 7B is an enlarged cross-sectional view of yet another example ofthe stage shown in FIG. 6D of a solder flow-impeding plug in a leadframe.

FIG. 8 is a plan view of an example of a packaged circuit including asolder flow-impeding plug.

DETAILED DESCRIPTION

FIG. 1A is a cross-sectional view of an embodiment of a packaged circuit100 including a lead frame 102 with a solder flow-impeding plug 108. Thelead frame 102 of the circuit 100 is composed of a plurality ofdistinct, electrically isolated, and generally planar sections 102-1,102-2, 102-3 of conductive material. The sections 102-1, 102-2, 102-3 ofconductive material are oriented such that the sections collectivelyhave a generally planar configuration. Each section 102-1, 102-2, 102-3comprises two primary surfaces: an external surface 103 and an internalsurface 105. The external surface 103 includes a plurality of externalterminals for coupling the lead frame to external circuits, and theinternal surface 105 includes one or more pads for mounting of one ormore components 116. In an example, one or more of the sections (102-1,102-2, 102-3) of conductive material can be floating, that is, one ormore sections of conductive material do not abut an edge (perimeter) ofthe package of the packaged circuit 100. An example of a floatingsection is section 530 of a lead frame 102 shown in FIG. 5, which isdescribed in more detail below. The lead frame 102 is composed of anelectrically conductive material such as a metal. In an example, thelead frame 102 is composed of copper.

As shown in FIG. 1A, one or more components 116 (also referred to hereinas simply “component 116”) are mounted to the internal surface of thelead frame 102. The one or more components 116 can include one or moredies and/or one or more discrete devices such as an inductor, aresistor, or a capacitor. In an example, the packaged circuit 100includes multiple dies in a multichip package such as, for example, toimplement a power conversion system. The power conversion system caninclude a power stage as well as a controller and/or driver for thepower stage. For example, the component 116 can include one or more of ahigh side FET, low side FET, or a diode (e.g., Schottky diode). Othercomponents such as a power inductor or passive components can also bemounted on the lead frame 102. In an example, the power conversionsystem can comprise a DC-to-DC power converter, a charger, a hot-swapcontroller, an AC-DC converter, a bridge driver, a buck converter, aboost converter, a buck-boost converter, a synchronous buck converter,or a portion of any of these circuits. In another example, the packagedcircuit 100 includes a single die in a single-chip package such as, forexample, to implement a power stage IC or a discrete component.

A top surface of the component 116 can be coupled to one or moresections 102-1, 102-2, 102-3 of the lead frame 102 by one or more wirebonds 118, copper clip(s), aluminum ribbon(s), or other interconnectmechanism. The wire bonds 118 can be attached to the internal surface105 of the lead frame 102 and to the top surface of the component 116.Molding compound 122 can surround the component 116 and extend partiallybetween and around the sections 102-1, 102-2, 102-3 of the lead frame102. The molding compound 122 can comprise any suitable molding compoundsuch as a thermoset, thermoset epoxy, or thermoplastic. The packagedcircuit 100 also includes a solder resist 110 on a bottom edge thereofin between sections 102-1, 102-2, 102-3 of the lead frame 102. Thesolder resist 110 can be composed of an electrically non-conductivesolder mask material (resist), including both organic and non-organicsolder mask material. Solder or another die attach adhesive 106 can beused to mechanically attach and electrically and/or thermally couple abottom surface of the component 116 to the lead frame 102 (e.g., section102-2).

The packaged circuit 100 also includes one or more solder flow-impedingplugs 108. A solder flow-impeding plug 108 is disposed between adjacentsections 102-1, 102-2, 102-3 of the lead frame 102 and functions toimpede the flow of solder 106 along edges of the sections 102-1, 102-2,102-3 during second level solder reflow events that occur afterencapsulation of the packaged circuit 100. The plug 108 impedes the flowof solder along the edges by plugging the space between adjacentsections 102-1, 102-2, 102-3 and adhering to the sections 102-1, 102-2,102-3. More detail regarding the plug 108 is provided below.

FIG. 1B is an enlarged cross-sectional view of the solder flow-impedingplug 108 and adjacent sections 102-1, 102-2 of the lead frame 102. Theplug 108 illustrated in FIG. 1B is disposed between section 102-1 andsection 102-2. The plug 108 adheres to the sections 102-1 and 102-2, inparticular to the edges of the sections 102-1 and 102-2, such that,ideally, there is limited or no space for solder 106 to flow from theinternal surface 105 to the external surface 103. In the examples shownherein, in addition to adhering to the edges of the sections 102-1,102-2, the plug 108 also includes overlap portions that overlap onto andadhere to a portion of the internal surface 105 of the sections 102-1,102-2 to further impede the flow of solder 108.

The plug 108 is composed of an electrically non-conductive material thatis adhesive to metal (the lead frame 102), such as a solder maskmaterial (e.g., resist), and can include organic and non-organic soldermask material. As a solder mask material, the plug 108 adheres morestrongly to the metal lead frame 102 than to the molding compound 122.This helps ensure that the plug 108 remains adhered to the sections102-1, 102-2, 102-3 of the lead frame 102 during handling of thepackaged circuit 100 after encapsulation.

FIG. 2 illustrates an enlarged cross-sectional view of the solderflow-impeding plug 108 individually. In the examples illustrated inFIGS. 1A, 1B, and 2, the plug has a general “T” shape comprising a mainbody 202 with an overlap portion 204, 206 on each side of the internalportion of the main body 202. The main body 202 is the portion of theplug 108 that is between the sections 102-1, 102-2, 102-3. Most of themain body 202 is below (toward the external surface 103) the internalsurface 105 of the sections 102-1, 102-2, 102-3. The main body 202 hasdimensions that fill the space between adjacent sections 102-1, 102-2,102-3 of the lead frame 102. The overlap portions 204, 206 of the plug108 are the portions of the plug 108 on the internal side of the mainportion 202 that overlap the internal surface 105 of the adjacentsections 102-1, 102-2. The overlap portions 204, 206 of the plug 108extend laterally wider than the main portion. The overlap portions 204,206, therefore, extend wider than the space between adjacent sections102-1, 102-2, 102-3 in order to overlap the internal surface 105 of thesections 102-1, 102-2, 102-3. In one example, the overlap portions 204,206 extend between 100 and 500 microns outward from the main body 202 tooverlap the adjacent sections 102-1, 102-2, 102-3. Although two overlapportions 204, 206 are shown in the cross-sections of FIGS. 1A, 1B, and2; it should be understood that the plug 108 can have overlap portionson all sides that abut a section of the lead frame 102.

The plug 108 is configured to impede the free flow of the solder orother die attach adhesive 106 during a reflow event. Hereinafter thesolder or other die attach adhesive 106 is referred to simply as “solder106”, however, it should be understood that other die attach adhesivescan be used. Additionally, since the plug 108 adheres to both adjacentsections 102-1, 102-2, 102-3, the plug 108 forms a mechanical couplebetween the adjacent sections 102-1, 102-2, 102-3. Moreover, in additionto impeding the flow of solder 106 out, the plug 108 also acts as abarrier to entry into the packaged circuit 100 and can, for example,reduce the ingress of moisture and external contaminants into thepackaged circuit 100.

FIG. 3 is a cross-sectional view of an alternative embodiment of asolder flow-impeding plug 300. This alternative solder flow-impedingplug 300 a main body 302 and an overlap portion 304 on one side of theinternal portion of the main body 302, but does not have an overlapportion on the opposite side of the internal portion of the main body302. Similar to plug 108, the main body 302 is the portion of the plug300 that is between adjacent sections of the lead frame, where most ofthe main body 302 is below the internal surface (105) of the adjacentsections. The overlap portion 304 of the plug 300 is similar to theoverlap portion 204 of plug 108; however, the opposite side of plug 300does not have such an overlap portion. The side of plug 300 not havingan overlap portion does not substantially overlap the internal surfaceof adjacent sections of the lead frame. An overlap portion may not beincluded on one or more sides of the plug 300 in order to reduce thearea on the internal surface of the lead frame used by the plug 300.Such a reduction in area may allow the lead frame to be smaller or mayallow the area on the internal surface that would otherwise have beencovered by the overlap portion to be used for other purposes, such asattachment of a lead. In an example, an overlap portion 304 may beincluded on sides of the plug 300 that are adjacent a large amount ofsolder, such as the solder 106 used to attach the bottom surface ofcomponent 116, while sides of the plug 300 that have little or no solderadjacent thereto do not have an overlap portion. As should beunderstood, an overlap portion 304 can be located on any one or more ofthe sides of a plug 300 as desired.

The solder flow-impeding plug 300 is composed of an electricallynon-conductive material that is adhesive to metal (the lead frame 102),such as a solder mask material (e.g., resist), and can include organicand non-organic solder mask material. As a solder mask material, theplug 300 adheres to adjacent sections of a lead frame. Such a plug 300having an overlap portion 304 on one or more sides and no overlapportion on one or more other sides can still impede the free flow ofsolder 106 during a reflow event. This is true even for sides not havingan overlap portion. Since the main body 302 fills the space betweenadjacent sections of the lead frame and adheres to the edge of suchsections, the main body 202 will impede the free flow of solder 106between the sections. Comparatively more impedance, however, may beprovided at the one or more sides having an overlap portion 304.

FIG. 4 is a cross-sectional view of yet another embodiment of a solderflow-impeding plug 400. The solder flow-impeding plug 400 includes amain body 402 without any overlap portions. Similar to plug 108, themain body 402 is the portion of the plug 400 that is between adjacentsections of the lead frame, where most of the main body 402 is below theinternal surface (105) of the adjacent sections. On plug 400, however,none of the sides includes an overlap portion, which substantiallyoverlaps the internal surface of adjacent sections of the lead frame.Such a solder flow-impeding plug 400 can be used to increase the area ofthe internal surface available for other uses. The solder flow-impedingplug 400 is composed of an electrically non-conductive material that isadhesive to metal (the lead frame 102), such as a solder mask material(e.g., resist), and can include organic and non-organic solder maskmaterial. As a solder mask material, the plug 400 adheres to adjacentsections of a lead frame.

FIG. 5 is a top cross-sectional view of an example lead frame 102 forthe packaged circuit 100. As shown, the lead frame 102 includes bothedge sections 532 and a floating section 530; with the edge sections 532abutting at least one edge of the packaged circuit 100 and the floatingsection 530 that does not abut an edge of the packaged circuit 100.Although in this example only a single floating section 530 is shown,other examples can include more than one floating section 530. The edgesections 532 and floating section 530 can include any appropriateexternal terminal(s) such as a pad or lead.

Manufacturing the circuit 100 into a package can include manufacturing aplurality of the packaged circuits 100 at the same time. Accordingly, aplurality of chip lead frames 102 can be assembled adjacent to oneanother, each having appropriate components 116 mounted thereon. Onceassembled, the lead frames 102 and associated components can besingulated to form the individual packaged systems. The followingdescription refers to the process of forming a single packaged circuit100, but it should be understood that the process can involve forming aplurality of packaged circuits 100 at the same time.

FIGS. 6A-6I are cross-sectional views of example stages in a method ofmanufacturing a packaged circuit including one or more solderflow-impeding plugs 108. The lead frame 102 and one or more components116 to be mounted thereon are obtained. The component(s) can befabricated as a die (e.g., a monolithic substrate) using appropriatesemiconductor processes. FIG. 6A shows a blank lead frame 102.

The lead frame 102 can be partially etched, as a first partial etch,from the internal (top) surface 105 along dividing lines 601, whichcorrespond to the spaces between sections of the final lead frame 102.The first partial etch is referred to as a “partial” etch since thefirst partial etch extends only a portion of the way through the leadframe 102 from the internal surface 105 to the external (bottom) surface103. The first partial etch results in a lead frame 102 having aplurality of trenches 602 defined in the internal surface 105 as shownin FIG. 6B. To perform the first partial etch, resist is placed on theinternal surface 105 of the lead frame 102, but resist is not placed onthe dividing lines 601 where the lead frame 102 is to be removed withthe etch. In an example, the first partial etch extends between 50 and75% of the way through the lead frame 102 and, in a particular example,extends around 62% of the way through the lead frame 102 which can beabout 0.125 mm into the top surface. In other examples, the firstpartial etch can extend in other distances. After the first partialetch, plating 604 can be deposited on the internal surface 105 of thelead frame 102 as shown in FIG. 5C.

After the first partial etch and before the second partial etchdescribed below and placement of the molding compound 122, the plug 108is formed in the trench 602 formed by the first partial etch as shown inFIG. 6D. In an example, the plug 108 is formed by screen-printing soldermask material into the trench 602. At a minimum sufficient solder maskmaterial is applied into the trench 602 such that the resulting plug 108extends all the way across the trench 602 and adheres to both sides. Ina particular example, sufficient solder mask material is applied intothe trench 602 to substantially fill the trench 602 up to or beyond theinternal surface 105 of the lead frame 102. In examples where the plug108 includes an overlap portion, the screen printing is controlled suchthat the solder mask material is deposited onto portions of the internalsurface 105 of the lead frame 102 adjacent the trench 602 on sides inwhich such an overlap portion is desired. Advantageously, applying thematerial for the plug 108 prior to mounting the component(s) 116 canimprove adhesion properties between the plug 108 and the lead frame 102by allowing the plug 108 to adhere to the lead frame 102 prior tosubjecting it to temperature excursions and the introduction ofcontaminants by upstream assembly processes before final encapsulationsuch as mounting of the component(s) 116 or wire bonding interconnects.Moreover, the edge formed by the plug 108 can be used to assistalignment of the component(s) 116 when mounting and the edge can helpcontrol solder 106 during first level solder reflow.

FIG. 7A is an enlarged cross-sectional view of another example of thestage shown in FIG. 6D of a solder flow-impeding plug 708 in a leadframe 102. In the example shown in FIG. 7A, the trench 702 formed by thefirst partial etch has a rounded profile characteristic of the etchingprocess. In conformance with the rounded profile, the solderflow-impeding plug 708 also has a rounded shape. It should be understoodthat a solder flow-impeding plug 108, 708 can have any desiredcross-sectional profile.

FIG. 7B is an enlarged cross-sectional view of another example of thestage shown in FIG. 6D of a solder flow-impeding plug 710 in a leadframe 102. In the example shown in FIG. 7B, the exposed surface 712 ofthe solder flow-impeding plug 710 is recessed above the trench 702,instead of being flat as shown in FIG. 7A. The recessed surface 712 isformed as a natural consequence of the solder mask material beingapplied to both the internal surface 105 and the trench 702 which arenot even with one another. That is, as the solder mask material for thesolder flow-impeding plug 710 is applied into the trench 702 and to theinternal surface 105 of the lead frame 102, the solder mask materialwill naturally form a recessed surface due to the different surfacelevels of the internal surface 105 and the trench 702 unless othermeasures are taken to counter this effect. It should be understood thatthe surface 712 of the solder flow-impeding plug 712 can have a recessof any depth or no recess at all (i.e., flat) as desired.

Once the solder mask material for the plug 108 is applied into thetrench 602, the component(s) 116 can be mounted on solder paste 106 onthe internal surface 105 of the lead frame 102 as shown in FIG. 6E. Inan example, the internal surface 105 of the lead frame 102 can be coatedwith the solder paste 106 using a solder mask and solder paint or aplurality of solder balls. In any case, the component 116 can be alignedwith and placed on the lead frame 102, for example, using flip-chipmounting techniques. In particular, each component 116 can be placedsuch that it is mounted to a future section (102-1, 102-2, 102-3) of thelead frame 102. As used herein a future section of the lead frame 102refers to a portion of the lead frame 102 that will be disconnected fromother portions of the lead frame 102 after the second partial etchdescribed herein. In some examples, the solder 106 can be reflowed oncethe component(s) 116 are in position on the lead frame 102.

In some examples, wire bond(s) 118, copper clip(s), aluminum ribbon(s),or other interconnect mechanism can be attached to the component(s) 116and lead frame 102 to achieve desired coupling as shown in FIG. 6F. Oncethe component(s) 116 have been mounted and all appropriate electricalconnections have been made, molding compound 122 can be flowed over thecomponent(s) 116 and the lead frame 102 to encapsulate the component(s)116 and the lead frame 102. In a process forming a plurality of packagedcircuits at the same time, molding compound 122 can be flowed over theplurality of assembled circuits. Once applied, the molding compound 122can be cured resulting in the structure shown in FIG. 6G.

Once the molding compound 122 is cured, the external surface 103 of thelead frame 102 can be etched as a second partial etch as shown in FIG.6H. The second partial etch can overlap the dividing lines 601 betweenfuture sections of the lead frame. Similar to the first partial etch,the second partial etch extends a portion of the way through the leadframe from the external surface 103 toward the internal surface 105. Thesecond partial etch can be aligned with the first partial etch andextend through the lead frame 102 enough to meet the first partial etchsuch that the plug 108 formed therein is exposed on the external surface103 side of the lead frame 102. The second partial etch can disconnectand electrically de-couple different sections 102-1, 102-2, 102-3 of thelead frame 102 at the dividing lines 601. That is, the second partialbottom etch occurs at a location on the lead frame 102 opposite thefirst partial etch such that the combination of the first partial etchand the second partial etch etches entirely through the lead frame 102and disconnects different sections of the lead frame 102 from oneanother. In an example, the second partial etch removes a laterallywider portion of the lead frame 102 than the first partial etch. Thesecond partial etch results in one or more trenches 608 defined in theexternal surface 103. To perform the section partial etch a resist isplaced on the external surface 105 of the lead frame 102, but resist isnot is placed on the dividing lines 601.

After the second partial etch is complete, an electricallynon-conductive material, such as a solder mask material (e.g., resist)110 can be applied from the external surface 103 side, between thesections 102-1, 102-2, 102-3 of the lead frame 102 and wherever elseappropriate resulting in the packaged circuit 100 shown in FIG. 6I. Thesolder mask material can include organic and non-organic solder maskmaterial. Additionally, input/output land plating, solder, or the likecan be applied to the external surface 103 of the lead frame 102.

When forming a plurality of packaged circuits at the same time, thecombined multiple packaged circuits can then be singulated to form aplurality of packaged circuits.

FIG. 8 is a circuit plan view of an internal surface of an examplepackaged circuit 100 showing example plugs 108. As shown, the plugs 108are disposed between adjacent sections 102-1, 102-2, 102-3 of the leadframe 102. The plugs 108 can extend laterally along the boundariesbetween sections 102-1, 102-2, 102-3 of the lead frame 102 as shown. Asshown, some sections 102-1, 102-2, 102-3 of the lead frame 102 can havea plug 108 therebetween while other sections do not have such a plug108.

The directional references top and bottom stated and illustrated in thisapplication should not be taken as limiting. The directions top andbottom are merely illustrative and do not correspond to absoluteorientations. That is, a “top” or “bottom” surface refers merely to arelative orientation with respect to the lead frame and is not anabsolute direction. For example, in actual electronic applications, apackaged chip may well be turned on its “side”, causing the “bottomsurface” described herein to face sidewise.

EXAMPLE EMBODIMENTS

Example 1 includes a method of manufacturing a packaged circuit having asolder flow-impeding plug on a lead frame, the method comprising:partially etching an internal surface of a lead frame at dividing linesbetween future sections of the lead frame as first partial etch forminga trench; applying a non-conductive material that is adhesive to thelead frame in the trench, such that the non-conductive material extendsacross the trench to form the solder flow-impeding plug; attaching oneor more components to the internal surface of the lead frame;encapsulating the one or more components and the lead frame; andpartially etching an external surface of the lead frame at the dividinglines to disconnect different sections of lead frame as a second partialetch.

Example 2 includes the method of Example 1, wherein applying anon-conductive material includes filling the trench at least up to theinternal surface of the lead frame.

Example 3 includes the method of Example 2, wherein applying anon-conductive material includes overlapping the internal surface of thelead frame adjacent the first trench on at least one side with thenon-conductive material.

Example 4 includes the method of any of Examples 1-3, comprising:applying a non-conductive material from the external side in betweensections of the lead frame at the dividing lines.

Example 5 includes the method of any of Examples 1-4, wherein thenon-conductive material comprises solder mask material.

Example 6 includes the method of any of Examples 1-5, wherein attachingthe one or more components includes attaching the one or more componentsto the internal surface using solder.

Example 7 includes the method of any of Examples 1-6, comprising:coating portions of the external surface of the lead frame with anon-conductive solder mask material.

Example 8 includes the method of any of Examples 1-7, comprising: wirebonding the one or more components to the lead frame prior toencapsulating the one or more components and the lead frame.

Example 9 includes the method of any of Examples 1-8, comprising:plating portions of the internal surface of the lead frame prior toattaching the one or more components.

Example 10 includes the method of any of Examples 1-9, wherein the firstpartial etch extends 50-75% of the way through the lead frame and thesecond partial etch extends at least the rest of the way through thelead frame.

Example 11 includes a packaged component comprising: a lead frame havinga plurality of electrically isolated sections of conductive material; anon-conductive plug disposed between two or more adjacent sections ofthe lead frame and adhered to the two or more adjacent sections of thelead frame, wherein the plug is composed of a non-conductive materialand functions to impede the flow of solder along edges of the two ormore adjacent sections during second level solder reflow events thatoccur after encapsulation of the packaged component; and at least onecomponent mounted on one of the plurality of sections of the lead frame.

Example 12 includes the packaged component of Example 11, wherein theplug includes a main body filling a space between the two or moreadjacent sections.

Example 13 includes the packaged component of Example 12, wherein theplug includes an overlap portion extending from the main body, theoverlap portion disposed on an internal surface of the at least one ofthe two or more adjacent sections.

Example 14 includes the packaged component of any of Examples 11-13,wherein the non-conductive plug is composed of a solder mask material.

Example 15 includes the packaged component of any of Examples 11-14,comprising: solder between the at least one component and the one of theplurality of sections of the lead frame, wherein the at least onecomponent is flip-chip mounted to the one of the plurality of sectionsof the lead frame.

Example 16 includes the packaged component of any of Examples 11-15,wherein the plurality of sections of the lead frame include at least onefloating section that does not abut against an edge of the lead frame.

Example 17 includes the packaged component of any of Examples 11-16,comprising: a solder mask material on portions of an external surface ofthe lead frame.

Example 18 includes the packaged component of any of Examples 11-17,comprising: molding compound on the lead frame and around the at leastone component.

Example 19 includes a method of manufacturing a packaged circuit, themethod comprising: partially etching an internal surface of a lead frameat dividing lines between future sections of the lead frame as firstpartial etch forming a trench; screen printing a non-conductive materialthat is adhesive to the lead frame in the trench, such that thenon-conductive material fills the trench; attaching one or morecomponents to the internal surface of the lead frame using solder;applying molding compound on the lead frame and around the one or morecomponents; partially etching an external surface of the lead frame atthe dividing lines as a second partial etch such that the non-conductivematerial applied in the first trench is exposed from the externalsurface, wherein the second partial etch disconnects adjacent sectionsof the lead frame; and coating portions of the external surface of thelead frame and spaces between sections of the lead frame with anon-conductive solder resist.

Example 20 includes the method of Example 19, wherein the non-conductivematerial applied in the trench comprises a solder resist.

What is claimed is:
 1. A method of manufacturing a packaged circuithaving a solder flow-impeding plug on a lead frame, the methodcomprising: partially etching an internal surface of a lead frame atdividing lines between future sections of the lead frame as firstpartial etch forming a trench; applying a non-conductive material thatis adhesive to the lead frame in the trench, such that thenon-conductive material extends across the trench to form the solderflow-impeding plug; attaching one or more components to the internalsurface of the lead frame; encapsulating the one or more components andthe lead frame; and partially etching an external surface of the leadframe at the dividing lines to disconnect different sections of leadframe as a second partial etch.
 2. The method of claim 1, whereinapplying a non-conductive material includes filling the trench at leastup to the internal surface of the lead frame.
 3. The method of claim 2,wherein applying a non-conductive material includes overlapping theinternal surface of the lead frame adjacent the first trench on at leastone side with the non-conductive material.
 4. The method of claim 1,comprising: applying a non-conductive material from the external side inbetween sections of the lead frame at the dividing lines.
 5. The methodof claim 1, wherein the non-conductive material comprises solder maskmaterial.
 6. The method of claim 1, wherein attaching the one or morecomponents includes attaching the one or more components to the internalsurface using solder.
 7. The method of claim 1, comprising: coatingportions of the external surface of the lead frame with a non-conductivesolder mask material.
 8. The method of claim 1, comprising: wire bondingthe one or more components to the lead frame prior to encapsulating theone or more components and the lead frame.
 9. The method of claim 1,comprising: plating portions of the internal surface of the lead frameprior to attaching the one or more components.
 10. The method of claim1, wherein the first partial etch extends 50-75% of the way through thelead frame and the second partial etch extends at least the rest of theway through the lead frame.
 11. A packaged component comprising: a leadframe having a plurality of electrically isolated sections of conductivematerial; a non-conductive plug disposed between two or more adjacentsections of the lead frame and adhered to the two or more adjacentsections of the lead frame, wherein the plug is composed of anon-conductive material and functions to impede the flow of solder alongedges of the two or more adjacent sections during second level solderreflow events that occur after encapsulation of the packaged component;and at least one component mounted on one of the plurality of sectionsof the lead frame.
 12. The packaged component of claim 11, wherein theplug includes a main body filling a space between the two or moreadjacent sections.
 13. The packaged component of claim 12, wherein theplug includes an overlap portion extending from the main body, theoverlap portion disposed on an internal surface of the at least one ofthe two or more adjacent sections.
 14. The packaged component of claim11, wherein the non-conductive plug is composed of a solder maskmaterial.
 15. The packaged component of claim 11, comprising: solderbetween the at least one component and the one of the plurality ofsections of the lead frame, wherein the at least one component isflip-chip mounted to the one of the plurality of sections of the leadframe.
 16. The packaged component of claim 11, wherein the plurality ofsections of the lead frame include at least one floating section thatdoes not abut against an edge of the lead frame.
 17. The packagedcomponent of claim 11, comprising: a solder mask material on portions ofan external surface of the lead frame.
 18. The packaged component ofclaim 11, comprising: molding compound on the lead frame and around theat least one component.
 19. A method of manufacturing a packagedcircuit, the method comprising: partially etching an internal surface ofa lead frame at dividing lines between future sections of the lead frameas first partial etch forming a trench; screen printing a non-conductivematerial that is adhesive to the lead frame in the trench, such that thenon-conductive material fills the trench; attaching one or morecomponents to the internal surface of the lead frame using solder;applying molding compound on the lead frame and around the one or morecomponents; partially etching an external surface of the lead frame atthe dividing lines as a second partial etch such that the non-conductivematerial applied in the first trench is exposed from the externalsurface, wherein the second partial etch disconnects adjacent sectionsof the lead frame; and coating portions of the external surface of thelead frame and spaces between sections of the lead frame with anon-conductive solder resist.
 20. The method of claim 19, wherein thenon-conductive material applied in the trench comprises a solder resist.